MF-SD013/250-2【PDF 1/3 页】FUSE PTC RESET 0.13A 250V SMD

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Sheet目录1230

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Features

■ Tip & ring line protection with two devices

in one surface mount package

Applications

Used as a secondary overcurrent protection

device in:

■

High voltage surge capabilities

Assists in meeting ITU-T K.20/K.21/K.45

speci?cations as well as Telcordia GR-1089

intra-building

RoHS compliant*

Agency recognition:

■ Customer Premise Equipment (CPE)

■ Central Of?ce (CO)

■ Subscriber Line Interface Cards (SLIC)

MF-SD/250 Series - Telecom PTC Resettable Fuses

Electrical Characteristics

Model

Max.

Operating

Voltage

Volts

Max.

Interrupt

Ratings

Volts Amps

(V) (A)

Ihold Itrip

Amperes

at 23 °C

Hold Trip

Initial

Resistance

Ohms

at 23 °C

Min. Max.

1 Hour (R1)

Post-Trip

Resistance*

Ohms

at 23 °C

Max.

Nominal Time

to Trip

Amps Seconds

at 23 °C at 23 °C

Tripped

Power

Dissipation

Watts

at 23 °C

Typ.

MF-SD013/250

250

3.0

0.13

0.26

2.0

7.0

10.0

2.5

1.5

* R1 value is measured 24 hours post re?ow.

Resistance matched in housing: 1.0 ohm measured 24 hours after re?ow installation.

Environmental Characteristics

Operating Temperature.................................... -45 °C to +85 °C

Maximum Device Surface Temperature

in Tripped State ............................................ 125 °C

Passive Aging .................................................. +85 °C, 1000 hours................................................±15 % typical resistance change

..................................................................... +60 °C, 1000 hours................................................±15 % typical resistance change

Humidity Aging................................................. +85 °C, 85 % R.H. 1000 hours ..............................±15 % typical resistance change

Thermal Shock ................................................ MIL-STD-202F, Method 107G,...............................±10 % typical resistance change

+125 °C to -55 °C,10 times ±15 % typical resistance change

Solvent Resistance .......................................... MIL-STD-202, Method 215B ..................................No change

Lead Solderability ............................................ ANSI/J-STD-002

Flammability .................................................... IEC 695-2-2 ...........................................................No Flame for 60 secs.

Vibration .......................................................... MIL-STD-883C, Method 2007.1, Condition A ........No change

Test Procedures And Requirements For Model MF-SD/250 Series

Test Test Conditions Accept/Reject Criteria

Visual/Mech. .................................................... Verify dimensions and materials .......................Per MF physical description

Resistance ....................................................... In still air @ 23 °C .............................................Rmin ≤ R ≤ Rmax

Time to Trip ...................................................... At speci?ed current, Vmax, 23 °C .....................T ≤ max. time to trip (seconds)

Hold Current .................................................... 30 min. at Ihold .................................................No trip

Primary

Test Test Conditions Protection

Mains Power Contact - ITU-T K.20, K.21 ........ 230 V rms, 10 ohms, t = 15 min........................None

Power Induction - ITU-T K.20, K.21................. 600V rms, 600 ohms, t = 0.2 seconds ..............None

Power Induction - ITU-T K.20, K.21................. 600 V rms, 600 ohms, t = 1 second. .................GDT

Lightning Surge - ITU-T K.20, K.21 ................. 1.5 KV, 10/700 μ s .............................................None

Lightning Surge ............................................... 4.0 KV, 10/700 μ s .............................................GDT

UL File Number ........................................... E 174545S

Thermal Derating Chart -Ihold (Amps)

Model

-40 °C

-20 °C

0 °C

Ambient Operating Temperature

23 °C 40 °C 50 °C

60 °C

70 °C

85 °C

MF-SD013/250

0.21

0.18

0.16

0.13

0.10

0.09

0.08

0.07

0.05

*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.

Speci?cations are subject to change without notice.

Customers should verify actual device performance in their speci?c applications.

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